Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.
unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-
Electronics Forum | Wed Apr 26 01:18:33 EDT 2006 | ge_lim
Hi We are in the process of developing a lead free product to be used in a non lead free selective soldering machine, i do have concern in these, and hope you guy can share your experienced expert opinion: 1. What does it take to convert to lead fre
Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto
Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e
Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter
Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.
Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold
Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
Electronics Forum | Fri Dec 23 06:09:04 EST 2005 | Slaine
good report showing lots of sections and compairng differnet pcb finishes http://www.smartgroup.org/experience/experience%20report%202005.pdf
Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Mon May 12 14:49:28 EDT 2014 | davef
Hi Evtimov 'hege gave you a plausible explanation for what's going on with solder running-up the lead of your components: TOO MUCH METAL!!! I've got different one. This explanation goes along the way that you're thinking, but just opposite. The rea
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
