Electronics Forum | Thu Aug 10 13:30:54 EDT 2000 | Bob Willis
Solder skips on SOT23 parts is the most common issue when soldering surface mount designs. The two most common causes are the wave height too low or there is too much gassing of the flux as it contacts and seperates the wave. Stck some parts on your
Electronics Forum | Fri Nov 09 13:41:06 EST 2007 | stepheniii
Don't forget that leadfree solder can leach the iron out of old solder tanks. Make sure yours is compatable with leadfree solder. You don't want the tank disolving, unleashing a tidal wave of molten solder.
Electronics Forum | Thu Jun 25 14:45:55 EDT 1998 | Chrys
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jul 13 10:10:48 EDT 2000 | Todd
Donnie In response to your questions; 1. Flux is Multi-core X32-10M 2. Preheaters temperatures can range based on board density. the goal is to get the top side to 100C before wave. 3. Components can't be placed after wave solder, they are surface m
Electronics Forum | Thu Jul 20 12:30:29 EDT 2000 | Bob Willis
Personally I would go for one alloy it just makes it all simple to control. I have only used tin/silver and tin/copper so far with good process results. Reflow is relatively straightforward, I have had more shorts with wave on tin/copper. To date I
Electronics Forum | Thu Jun 21 22:42:45 EDT 2001 | davef
We're doing one of those review things for some reason that none of us can remember. We just printed-out the product sheets on a whole pantload of SMT capacitors [rather than use the old moldy ones we have in some file cabinet ... BIG mistake] that
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Mon Jun 14 07:41:47 EDT 1999 | Vinesh gandhi
Dear All, We are having a big debate over what is the industry standard in DPPM on the wave sodlering process. is a DPPM of about 800 satisfactory. As per our big bosses it should not be more than 50 DPPM. Is the figure realistic. We are typicall
Electronics Forum | Mon Jan 28 00:48:21 EST 2002 | peterson
Being in the backplane biz, we too, encounter similar problems...especially when our customer reads the IPC as Biblical (you will achieve 75% fill or be turned into a pillar of salt). Anyway, recently, one of our process engineers suggested paste-hol
Electronics Forum | Sat Dec 14 15:25:31 EST 2002 | MA/NY DDave
Hi To me, something seems wrong with your process. I have never had to do what you are suggesting, yet I can imagine your difficulty with fluffy (easily floating) components. I won't give all the technical details, instead I would ask you to have
