Electronics Forum | Thu Jul 30 14:16:27 EDT 2009 | joeherz
We are running a selective solder machine using SN100C alloy. We have had J-STD-001 analysis performed every 2 months and our last analysis showed our nickel content at 0.104%. The max allowed is 0.100%. We changed out the pot (only 30 lbs) but I'
Electronics Forum | Sun Nov 22 09:36:17 EST 2009 | patrickbruneel
Dave, A low residue/No residue flux does exist that when an excessive amount of flux is applied it would only create a cosmetic problem not a reliability issue. The active ingredients are neutralized by the heat applied in the soldering machine and
Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist
Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re
Electronics Forum | Fri Mar 26 21:48:56 EDT 2010 | dman97
Can someone explain to me what I'm supposed to do after I have done the vision offset calibration procedure? The manual tells me to put solder paste down on all 25 holes of the stencil. After this the board drops down and the machine scans each fidu
Electronics Forum | Sat Aug 21 02:27:21 EDT 2010 | isd_jwendell
The paste you dispense will not solder the same as the one you use with a stencil. The paste for the stencil will have a higher metal content. I was not working with dispensing as small as you are, but after evaluating the cost of the stencil vs. lon
Electronics Forum | Fri Sep 03 06:53:38 EDT 2010 | arjan
Yes, we assembled a lot of QFN in the last years, but we don't have a X-ray machine by ourself, so we cant't inspect each device. This type LGA was designed on a prototyping board of our customer so we would validate our LGA reflow process and a rese
Electronics Forum | Fri Nov 05 12:25:42 EDT 2010 | deanm
I think you are right. According to IPC-7526 section 6.2 says that using compressed air to blow out paste will damage the stencil, especially between fine pitch apertures. It can also broadcast solder paste onto other surfaces or personnel. I recomm
Electronics Forum | Tue Nov 16 13:00:20 EST 2010 | Shean Dalton
ASSCON offers a range of Vapor phase reflow soldering systems. Available in benchtop, batch, inline, vacuum inline. The US distributor for ASSCON is ATEK at http://www.atekllc.com/html/vapor_phase_.html The ASSCON website: http://www.asscon.de/e
Electronics Forum | Wed Nov 17 05:20:38 EST 2010 | jlawson
Also please contact Rehm Thermal, they make best Vapor Phase systems in terms of cost of onwership - less galden usage than Asscon or IBL, have more controllable ramp rate control vs the other vendors also...use patented galden injection on demand an
Electronics Forum | Wed Jan 26 10:43:32 EST 2011 | grahamcooper22
From our experience with our gel fluxes the depth of the flux cavity can be 30% ~ 70% of the ball diameter. You'll probably need to do some tests to find the optimum for your process. If you have really fast movement on pick and placement machine the
