Electronics Forum: wave solder machines (Page 481 of 677)

Re: SOT-23-6

Electronics Forum | Fri Jun 26 16:23:14 EDT 1998 | Steve Gregory

Hi Dave! Yeah, they've been around a while, and they're pretty straight foward like you said. About the only things that I can think of that I've run across that causes problems with these guys is when they're used on the bottomside of the board

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane

I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of

Re: S.P.O.T.T.

Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc

Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs

Wavesoldering SPC

Electronics Forum | Thu Feb 01 12:46:19 EST 2001 | cebukid

conveyor speed x dwell time = contact length and =====> inches / seconds x seconds = inches. First run your pump at a constant speed.....THEN,.... try running your glass plate at a very fast speed, and then you'll notice that your lengt

Solder wetting test for PCB's

Electronics Forum | Mon Apr 23 19:12:23 EDT 2001 | relensky

Thanks for the instructions. I was missing the reflow part... Omikron is the method our board house offers. We have been through the plating thickness problem and tin depletion conditions. Beyond those issues, I have been trying a few different n

PIHR Inspection Criteria

Electronics Forum | Fri May 18 13:30:52 EDT 2001 | mparker

I will start with the statement that I think it is great that we have the ability to solder SMT components that emulates wave soldered components. With that in mind, I would want to find acceptance criteria to be similiar, regardless of the solder me

Re: Flash Gold over Nickel - PCB finishing

Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F

Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Fri Jan 14 08:05:23 EST 2000 | Pat Pepper

Hi Dave, Thank you for the response. In answer to your responses I'll use the original numbers of my questions. 1. We would like to turn around our boards fast, but sometimes due to the market conditions we wind up with inventory. After reading

Re: no clean rework

Electronics Forum | Tue Aug 10 05:51:03 EDT 1999 | Gian.D

| | hello to everybody, | | we have a really satisfactory no clean process, both smt/reflow and wave soldering, but we get troubles with defects rework; | | does anybody know how to eliminate flux residues or how not to produce them during rework op

Re: Visual Inspection after SMD Placement and After Wave Solder

Electronics Forum | Thu Jul 15 10:28:49 EDT 1999 | Boca

| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti


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