Electronics Forum: wave solder machines (Page 536 of 677)

bottom side epoxy

Electronics Forum | Wed Oct 06 21:45:20 EDT 1999 | John

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement b

Solder paste in Syringe vs Jar

Electronics Forum | Wed Nov 06 10:17:45 EST 2002 | davef

In order from best, better, good * Lowest purchase price: cartridge, jar, syringe * Ease of inventory control: cartridge, jar, syringe * Flexibility of use: jar, syringe, cartridge * Ability to dispense by hand or machine: syringe * Cost to get paste

Selective Laser Soldering

Electronics Forum | Thu Jun 03 18:10:28 EDT 2004 | g2garyg2

It sounds like you will need to pre-heat the aluminum beofre using even a laser to solder this type of application. While lasers are great for many applications, especially those that have challenging keep out areas, thermal mass issues (with approp

25 mil QFP soldering issue

Electronics Forum | Mon Jul 19 19:39:06 EDT 2004 | KEN

I once had a forced convection oven (insert brand here)...and the top 220VAC heater (reflow zone) had shorted to the frame ground, blowing the branch line fuses. THe machine had no idea the heater was out because the lower heater was heating the upp

Solid Solder Deposit

Electronics Forum | Thu Aug 05 19:10:53 EDT 2004 | celldude

wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe

Solid Solder Deposit

Electronics Forum | Sat Aug 07 17:27:00 EDT 2004 | celldude

We use ssd on all components, from 0201 to very large fine pitch and bga's. With some very small micro bga's , if there is a problem with bridging, we will tape off the stencil during the ssd process and just use bare pads...along with the solder fr

AOI: Comparisons

Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution

I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i

Hirose Connector Installation........

Electronics Forum | Wed Aug 24 22:53:34 EDT 2005 | mrduckmann2000

We have a customer that is using the new Hirose connector p/n df30fc-40dp-0.4v. The connector has lead spacing of .4mm. I beleive that if I have a stencil cut to 2-3 mil I should have enough solder paste to solder the connector to the PCB pads. Ho

QFP Shifting / Solderability Issue

Electronics Forum | Thu May 31 19:45:47 EDT 2007 | diesel_1t

We place a QFP 256 leads 20 mil pitch, had a lot of troubles with shifted components and solderability issues. solderability is not a problem anymore; we solved with a ramp-to-spike profile with .9�C/s 'til 183� then spike to about 118�C, TAL ~60s. W

Foam in the wash

Electronics Forum | Wed Jun 13 12:19:25 EDT 2007 | allwave

Brian, We had similar problem in our inline wash machine time ago. We checked everythin on equipment (filters, DI water purity, sprayers angle, etc). To make the long story short, we found out that the problem was caused by a new solder paste. This s


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