Electronics Forum | Tue May 19 16:32:54 EDT 1998 | Chrys
| | Earl, | | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post i
Electronics Forum | Tue Apr 28 14:50:43 EDT 1998 | Chrys
| | We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | | PCb substrate to compensate for thermal stressing in a | | Space enviroment. Has any one any ideas or contacts for | | dissolvable pads. this only applies to leadless components | Ro
Electronics Forum | Tue Apr 14 18:01:28 EDT 1998 | Mike C
We received a letter from IPC concerning patent infringements (patents held by Matsushita Electric Industrial Co.) LTD (Panasonic) that may effect most of us who use adhesive to secure components to PCBs for subsequent wave soldering process. If you
Electronics Forum | Thu Apr 16 11:50:24 EDT 1998 | Gary Simbulan
| O.K., somebody read a probably hand-written 3 as 8. | Under these numbers, I can find at IBM's Patent Server the following other topics: | USP 4,312,692 | http://www.patents.ibm.com/details?patent_number=4312692: | USP 4,314,870 | http://www.pat
Electronics Forum | Sun Feb 15 10:47:16 EST 1998 | SMT-ASSY
In reference to your Email response, we will propose to you in the next few days a course curriculum which we hope you will find of great interest. As we told you we offer courses for assemblers and techs in PTH, SMT soldering, SMT full process using
Electronics Forum | Fri Aug 24 19:08:17 EDT 2001 | stefo
Happy Friday All! Well, it seems another "opportunity" has presented itself to me. Looking to assemble a 24" X 24", 52-layer board... piece-o-cake, right? Not real sure of all the components that are on it, but I do know that there is some 20-mil
Electronics Forum | Thu Oct 18 18:37:49 EDT 2001 | davef
You�re correct. Probably every supplier�s product has slightly different cure characteristics. Let me spin this up a little differently � There was a slight imbroglio in my office this morning involving a couple of stalwarts and the last Krispy Kr
Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
Electronics Forum | Wed Jul 24 11:46:58 EDT 2002 | johnw
Claude, your not a manager by any chance are you?... you can't charge them for breaking them. Ok so yes there will be poor handling but if your going to fix the problem you have to look at teh route cause of it and fix that. You should be settign up
Electronics Forum | Mon Aug 19 20:44:01 EDT 2002 | davef
George: There is no industry standard for the calculation of process capability. Although, you should be aware of IPC-9850, Surface Mount Placement Equipment Characterization Actually, there is a grand bulk of discussion on process capability in t
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