Electronics Forum | Mon Jan 27 12:27:03 EST 2003 | ksfacinelli
We have an assembly that requires a number of high density connectors to be placed after SMD. The process will not allow a normal wave solder setup due to the population of SMD comps. We cannot use a selective solder pallet due to profiles. We are
Electronics Forum | Thu Feb 17 14:00:30 EST 2011 | aribeiju
We have a problems with soldering in the PCB in the Solder Wave process. Our pcbs are failures in the solder (voids) in the throughole components. The main problems is in varistor components. what are the soluctions to problems? tks
Electronics Forum | Thu Dec 22 06:46:01 EST 2011 | rameshraja
Dear All, We are doing PCBA's manufacturing,Inprocess we are doing manual soldering, reflow and wave soldering process, As per ISO-7.5.2 Process validation ( Special process ) Soldering process is considered as an special process, hence in order to
Electronics Forum | Thu Dec 09 09:51:34 EST 2004 | russ
One of the things that I have found is the "benchtop/lab" type waves (Low cost) do not perform very well except on the simplest of products, they are lacking critical design elements such as adequate preheat length, laminar flow nozzle design, etc.
Electronics Forum | Wed Nov 16 18:25:11 EST 2005 | Mike F
Check out the Unit Design web site and look at their drag soldering machines. You do not want to try to do any of this manually. How consistent are your operators when working above a 500 F solder pot? I strongly recommend you buy one of the books
Electronics Forum | Thu Aug 23 16:28:14 EDT 2007 | grics
I want to get a collective opinion from the forum... I was always under the impression that Humidity at SMT can be a disaster and can cause solder balls... But what about at the Wave/Selective solder? If every board or almost every board has solder
Electronics Forum | Fri Apr 22 11:27:14 EDT 2005 | chunks
SMT adhesive works great! We actually cut stencils to print adhesive in between areas that always solder short over wave. It's the perfect solder resist. Change a customers board? I thought only Satin could do that?
Electronics Forum | Mon Oct 16 20:45:45 EDT 2000 | Dave F
Thanks Nance. So, your production process is: * Screen / dispense glue on secondary side * Place secondary side SMT components * Cure glue * Insert primary side PTH components * Wave secondary side Please tell us about: * Flux type and wave s
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
Electronics Forum | Thu May 28 09:48:08 EDT 1998 | Steve Herring
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
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