Electronics Forum | Thu Jun 18 20:57:12 EDT 1998 | Dave F
BACKGROUND: We just got back from a neighborly visit at one of our board fabrication shops. I saw something interesting. Their HASL machine was just short of being field stripped. The story I caught was, the air pressure from knives change over
Electronics Forum | Fri Jun 12 08:22:22 EDT 1998 | Al Carr
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Fri Jun 12 08:20:59 EDT 1998 | Al Carr
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Thu Jun 04 11:23:44 EDT 1998 | Frank S
If you could measure and chart 3 variables in my process, what would they be? The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure 7"
Electronics Forum | Thu Jun 04 11:57:59 EDT 1998 | Pete M
Be more specific on your problems? | If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. The
Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Fri Apr 03 03:41:04 EST 1998 | Frank J. de Klein
150 secs. On bilayer boards (Cu only at top and bottom) you can typically not reach differences top to bottom bigger then 35-40 C. For multilayers however, the maximum is 15-20 C. If you actively cool a multi- layer at the bottom during the 2nd pass,
Electronics Forum | Thu Aug 23 11:19:40 EDT 2001 | Hussman
Hi delnosa, Sorry about being 10 days late - don't get to the bottom of the page much. I'm working of layering flex circuits sandwiched between FR4 layers. The flex is primarily designed to take the place of interconnects like yours. I work in ap
Electronics Forum | Sat Oct 13 16:42:35 EDT 2001 | kenbliss
I agree with EMC based on what you described, and they build good pallets along with a few others, a small word of caution is that pallets are bit expensive typically several hundred dollars or more each. So if you find that is the road you go, be s
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