Electronics Forum | Mon Jun 05 14:35:17 EDT 2006 | marc
Yes.... stop checking on your process.... :) Seriously...if you cleaning the boards after I would suspect no issues. If your leaving the flux on the board (I suspect they are using quite a bit) then I would be concerned. Since the boards have al
Electronics Forum | Tue Apr 17 01:45:16 EDT 2007 | Jane
There are several alloys had been using in the industry. For SMT: most people use SAC305 For Wave: most of them use SAC305,SC100C,SCS7,and SACX0307. Of course, different alloy composition have its own recommended profile. There is no such rule tellin
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Thu Jul 05 19:37:15 EDT 2007 | davef
We assume the three leads are lined-up perpendicular to the wave. Without taking corrective action, we know this: * 50 thou pitch will bridge * DIP do not bridge As a corrective action that doesn't invovle a respin of the board, decrease the solderm
Electronics Forum | Mon Jul 16 16:02:08 EDT 2007 | ck_the_flip
I have zero experience with SN100c, but hey, how much different can it be from Sn63Pb37?! We solder large connectors all the time - sometimes these connectors reside on a ground plane area. We've been able to overcome hole fill issues (on 63/37) th
Electronics Forum | Thu Oct 01 13:33:01 EDT 2015 | marlyn
Hey there fellow people with SMT > issues... What's the proper procedure for > soldering through-hole headers on the back-side > of the PCB (pins poking out on same side as SMT > parts)? ( Yes - I did the SMT side first and am > now faced with L
Electronics Forum | Thu Sep 03 01:15:52 EDT 2020 | kylehunter
> The problem that we have seen applying NC flux > (EF2210) at selective solder is that the flux > overspray (relative to the nozzle path) did not > see high enough temperature to activate the flux > and turn it to a non-conductive
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon
| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han
Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach
| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H
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