Electronics Forum | Thu Apr 30 22:40:32 EDT 2009 | davef
Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies Written by Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera Circuits Assembly Magazine, 31 December 2008 19:00
Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
Electronics Forum | Fri Nov 13 18:29:50 EST 2009 | luisreyes
really need help!! Our company is experiencing a change on the Quality system. one of the things that we are discovering is the amazing variation during the reflow oven and wave solder processes. this week we found that the team had not been performi
Electronics Forum | Mon Dec 21 11:28:47 EST 2009 | lynn_norman
We used Loctite 3609 and never had problems. If memory serves me isn't 3606 a screen print adhesive? First thing I would check is the cure profile of the adhesive. If it doesn't develop full adhesion, could be problems. Nuther question is are you
Electronics Forum | Wed Jan 27 13:55:47 EST 2010 | patrickbruneel
Randy, Thank you for the acknowledgment. The IF2005Mz is a solvent based flux (not water soluble). I agree with you that the original IF2005M had a very narrow process window. In 2000 we modified the blending procedures and blending equipment which
Electronics Forum | Fri Oct 29 09:51:22 EDT 2010 | scottc
Darron Good morning, I hope you are doing well. Referbishing fixtures is not a popular solution, the better way to confirm you are getting the lifecycle out of the fixtures is to contact an expert on fixtures and have them evaluate your process. T
Electronics Forum | Sun Mar 20 14:47:29 EDT 2011 | floydf
We are going to be placing BGAs for the first time, and I have some questions. Is it recommended top bake all of the boards and all of the BGAs before production? I have had good luck baking boards that didn't wave solder well. It usually turns out
Electronics Forum | Thu Aug 04 20:35:33 EDT 2011 | zywong
Hi All, I'm facing a problem is the PCBs are having delamination issue which after SMT reflow process & wave solder process. Dose anybody faced this issue before? The profile setting are correct settings. Some question i wonder: 1) Is that long time
Electronics Forum | Sun May 27 17:27:22 EDT 2012 | jlawson
I would suggest that the pad size vs lead length vs lead pitch are helping cause issue if rest of PCB is ok From DFM , yes reducing lead length - experiement or reducing pad diameter could help. Also flux can still be issue, try fluxing part prior
Electronics Forum | Mon Jun 04 16:27:55 EDT 2012 | jorge_quijano
Hello there, I just want to ask you how often do you take your profiles on the Reflow Oven and Wave solder? I have a HMLV line running 5-6 products per shift (Reflow Oven & WS) my tech spend too much time checking the profile, but no major difference
