Electronics Forum: wave soldering (Page 416 of 482)

How to choose a new solder paste

Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp

Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux

Thermocouple attachment on fine pitch component.

Electronics Forum | Wed Apr 11 14:05:30 EDT 2001 | davef

No, there's not a really great epoxy product for attaching thermocouples in reflow. Specifically, what's your problem? From Sanders Temprobe verbage ... Adhesives There are two general classes of material commonly used to adhesive bond thermoc

Re: electronics assembly clip art

Electronics Forum | Thu Mar 25 14:13:13 EST 1999 | Bob Willis

| | I am looking for clip art images of electronics assembly. Images like wave soldering, surface mount components, soldering irons... just general assembly graphics. Many sites have different individual images that they use I was just wondering if

Re: Backplane Assembly Info Request

Electronics Forum | Mon Mar 08 11:46:38 EST 1999 | Wendy Casker

| Hello; | | I am looking for general info on backplane assemblies. Any info would be appreciated, but some of the questions that come to mind include: | | -What part types other than connectors do backplane cards have on them? SMT? Leaded? Qua

Re: Gold Finger Cleaning

Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon

| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Apr 07 05:41:34 EDT 1998 | Bob Willis

Based on work I have been doing recently the most common reasons for component loss is board flexture and vibration on the reflow process. If parts do not reflow then weight is not an issue. There is a video on double sided reflow and PIHR from the S

adhesive for thermocouple

Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef

Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes

SPI and AOI Machine Feaures.

Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby

Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there

Lead Free Transisition

Electronics Forum | Tue Sep 04 03:10:35 EDT 2007 | chrispy1963

We've got 2 lead free lines running at present and one leaded. Our lead free pallets and stencils were both leaded before changing over. Just take care to remove any built up flux from the pallets as well as hidden leaded solder deposits prior to r

Paste in hole (state of the art)

Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika

Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h


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