Electronics Forum | Fri Mar 12 18:12:15 EST 1999 | B. Walton
Spray cleaners are poor alternatives to todays ultrasonic stencil cleaners. Ultrasonics are the way to go and you can use rather benign water based chemistries to get the job done. As for screening adhesives and cleaning glue residue with spray wands
Electronics Forum | Sat Mar 06 18:09:31 EST 1999 | Steve Gregory
Hi Ya'll... I'm in here again today trying to deal with my down wave solder. I've been beatin' my head against the wall for the last couple of days, it's a Soltec Prisma and the conveyer keeps jamming. What it's doing is up at the exit end where th
Electronics Forum | Fri Feb 19 16:45:55 EST 1999 | Steve Gregory
Hello Ryan! There's a company called Camalot that sells dispensers that in my opinion, make one of the better dispensers on the market. They use what's called a rotary-positive displacement pump when dispensing... much more precise and accurate
Electronics Forum | Tue Dec 01 14:30:48 EST 1998 | John
| | | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect
Electronics Forum | Fri Jul 10 13:16:27 EDT 1998 | Bill Schreiber
To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating capibil
Electronics Forum | Mon Jul 20 23:40:31 EDT 1998 | Alex Ondi
| To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. | I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating cap
Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
Electronics Forum | Thu Apr 30 17:03:45 EDT 1998 | Ray N. Lopez Mata
| | | | | | | Hello - | | | | I am interested in obtaining information on the possibility of integrating a Vision Inspection System with an SMT line. I am aware of systems which may be used to gather placement data and such, but are there any system
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis
Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma
