Electronics Forum: wet (Page 146 of 182)

PCB Trouble shooting Lab

Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL

With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including

Solder wetting test for PCB's

Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef

Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur

Wet behind the ears

Electronics Forum | Sat Apr 28 11:55:39 EDT 2001 | kaoni

Well, I hope I don't offend anyone. I'm brand new to this. I am considering starting my own assembly line to handle my own products but would like to be able to utilize my downtime as an opportunity to keep the machines running by trying to pick up a

Seeking a professional response to my inquiry please.

Electronics Forum | Sun Apr 29 22:34:30 EDT 2001 | kaoni

Well, I quess I will have to go forward in order to go backward. Thank you for replying Dave (I think). I intend to hire professional (EXPERIENCED) Manager/Engineers and operators that are already well entrenched in the business. I am a businessman a

Wet behind the ears

Electronics Forum | Mon Apr 30 10:06:13 EDT 2001 | CAL

John- Just few ideas at random (brainstorming) - While times are slow invest in training of your current staff. There are some great training facilities out there offering valuable knowledge. Knowledge is a valuable thing to have and will prove to be

Re: Paste Push-Out In PP Assembly

Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis

So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free

ENIG again! Failed BGA joint!

Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair

We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With

Soldering to Immersion Tin surface finish

Electronics Forum | Mon May 14 17:14:07 EDT 2001 | davef

First, consider checking the fine SMTnet Archives. Look for threads on "white tin", in addition to "immersion tin". We�ve had a cuppla good ones of late. Merix [http://www.merix.com] gives a good comparison of different solderability preservatives

QFP Defect

Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan

Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle

0402's for the first time!

Electronics Forum | Wed Jul 25 23:35:18 EDT 2001 | mugen

my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t


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