Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
Electronics Forum | Fri Jun 25 01:11:31 EDT 1999 | Vinesh Gandhi
| | | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody
Electronics Forum | Mon Feb 15 15:43:06 EST 1999 | Dave Jurena
Hope some of you out there can help me with this one. I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they do
Electronics Forum | Fri Feb 12 10:44:02 EST 1999 | Bill Haynes
I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the pr
Electronics Forum | Wed Oct 28 17:30:55 EST 1998 | Chrys
| | Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | | | That information should be contained in the technical data sheets suppli
Electronics Forum | Tue Oct 06 15:50:12 EDT 1998 | Bill Tuttle
We are experiencing poor wetting on various components placed on a PCB with En-Tek coating. Is anyone else experiencing simular problems ? We have the following questions: 1. How can the thickness of the En-tek coating be measured? 2. Is En-tek vol
Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
Electronics Forum | Wed Sep 30 20:56:31 EDT 1998 | Tony Barry
Assuming that your components and PCB's have good solerderabillty and are stored in an air conditioned environment and kept free of contaminants then your problem sounds as though there is insufficient wetting of the component leads due to low temper
Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle
I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything
Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr
| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly
