Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Mon Feb 21 03:51:37 EST 2005 | abhirami
Solder paste thickness control is more important in SMT process. What controls do you have? I guess if everyone follows the critical control path, then there are always reduced problems. The issue is no one is perfect. Paste tends to be on the stenci
Electronics Forum | Fri Apr 29 08:39:01 EDT 2005 | davef
Few solder paste suppliers recommend freezing solder paste. Check with your supplier for recommendations. Examples are: * In many cases, nothing happens. However, some pastes are susceptible to damage that impairs paste performance. As a consequenc
Electronics Forum | Mon May 09 10:52:29 EDT 2005 | patrickbruneel
Hannu, First and for all I have a problem with your question "tried and trusted" for the simple reason that you are going to change too lead-free. Ultrasonic soldering or welding is not new, as far as I know it is only used applying the ultrasonic
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Wed Jul 06 13:06:22 EDT 2005 | patrickbruneel
Dave, Great to see you more involved in the lead-free. I assume the tests you have done were in lab environment, would it be possible to explain how you measured the area reduction (loss of weight or reduction of diameter/thickness) and how did you
Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd
This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly
Electronics Forum | Wed Aug 10 20:30:49 EDT 2005 | slthomas
I've got a new board (actually a new panel...a 4 up, with one row rotated, where it was a 2 up panel with no rotation before) that runs fine on the IVc but not on the IIIc. I've used the same reference points for the image rotation (fiducials) on bot
Electronics Forum | Fri Aug 12 09:50:19 EDT 2005 | fctassembly
It is true that the SAC alloys are very aggressive to unprotected solder pots but the SN100C lead free alloy can be used in these pots IF they are not already being wetted by your SN63 alloy. FCT Assembly offers a program that includes free tin wash
