Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug
I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap
Electronics Forum | Fri Dec 02 08:57:39 EST 2005 | russ
You hit it on the nose Pavel, the fluxes in paste are formulated to have 2 activating points if you will, one at low temp and one at high temp. when the low temp flux gets killed this is what you will see. This is the main reason we opted out of K
Electronics Forum | Fri Jan 20 09:58:48 EST 2006 | adlsmt
We are using SAC for reflow because of the lower temp and better wetting and copper disolution is not so much an issue in reflow. There is not much difference in the alloys and they can be mixed with no problems. I assume any supplier of SN100C cou
Electronics Forum | Mon Feb 06 13:00:51 EST 2006 | amol_kane
Hi all, I just wave soldered 40 boards (20 if Imm Sn and 20 of Imm Ag) using SAC 305 (in this case the wave machine manufacturer (electrovert) suggested the alloy too). plan to carry out x-sectioning to see the results. overall, just from the visual
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Wed Mar 15 09:28:30 EST 2006 | mapell
Vick I would not think what your seeing is normal. Just guessing without a profile but.... - not reaching peak temperature - not enough soak time or mild ramp to burn away the flux - shortened TAL, not allowing proper time for the solder to wet - lo
Electronics Forum | Thu Mar 30 08:48:37 EST 2006 | russ
So you have solder balls at the outer edge of the part right where the pad goes underneath? If so you just have too much solder but I wouldn't worry about them. the solder usually does not wet to the edges of these parts because of the exposed copp
Electronics Forum | Tue May 23 09:16:57 EDT 2006 | Steve
Had exactly the same type of issues. Tried everything from pre fluxing the pcb's , various ammendements to the oven profile and various pastes. Finally after a lot of help from multicore we settled on a paste by the code of cr39. A no clean flux wit
Electronics Forum | Tue May 23 09:36:11 EDT 2006 | Steve
Not being funny here but I understand exactly what you are saying and sounds exactly the same as we experienced. Seriously try a different paste. Give Tamura a ring and I am sure they will give you a sample. I don't have the exact part code but they
Electronics Forum | Tue May 23 09:50:37 EDT 2006 | flipit
They work well in silver conductive epoxy in hybrid applications. They are very poor in no clean applications. They don't work that well in OA solder paste either. Used them once in OA paste and in a nitrogen. They looked just fine. Solder to Pd
