Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef
RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Wed May 07 15:36:04 EDT 2008 | llaerum
The 483 is what we use on all boards except on one where the 353 improved wetting on resistor packs. It worked much better since the parts are LF and this is the same flux AIM uses in their LF solder. Yes, it was recommended by AIM when we discussed
Electronics Forum | Fri May 17 10:53:15 EDT 2013 | davef
ENEPIG or Imm Pd? Concerns about palladium as a solderability protection are: * Palladium is more difficult to process in fab than gold * Palladium solder alloys can be brittle, similar to gold, without proper soldering process and/or specification/
Electronics Forum | Wed May 07 15:26:05 EDT 2008 | joeherz
Interesting - We're using the same AIM products as you. On the lead free, 353, did you start out with it or did you try the WS485? That was the 1st product recommendation we got from AIM and we found that the lot to lot consistency was not good. T
Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL
SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed
Electronics Forum | Wed May 22 16:36:13 EDT 2002 | slthomas
What methods do you guys use for maintaining lot and/or board traceability? When I worked in med. products, we used travelers that we recorded everything on, then serialized them at the end of the build. Not as effective as up front serialization,
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak
Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress
