Electronics Forum | Tue May 10 15:57:43 EDT 2011 | jamike
Hi I am responsible for the whole of production and test and have been given the job by my manager to get accurate job times on all assemblies timing various staff. I have 18 years experience working in all areas of production and test so I know the
Electronics Forum | Thu May 12 08:29:54 EDT 2011 | don7888
Hi I am looking at reducing the time it takes for our operators to complete a first off on the first board that comes off the p+p machine. I started off by conducting some RCA to find out what was the main cause of boards failing the first off. From
Electronics Forum | Fri May 27 05:16:28 EDT 2011 | aj
Hi, There are quite a few suppliers so you could have a lot of work on your hands trying them all. Do a bit of research finding out what paste all the big guns use? they spend a fortune doing evaluations etc But you should get at least 3 different
Electronics Forum | Tue Jun 07 00:21:42 EDT 2011 | jacki
Hi All Currently, we encountered that the schottky barrier diode was up side down or misalignment during SMT process.And, many parts were blown away as pick up error. What we found is its package space is a little bigger for parts to move. I seek y
Electronics Forum | Wed Jun 08 23:03:47 EDT 2011 | grics
Can you massage the data manually? Extract the centroid data (file) from your P&P and either in notepad or excel perform the scrub then repaste to match the proper lines/columns in the csv file? Aside from gerber translation for new XY or identifyi
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
Electronics Forum | Thu Jun 16 16:50:37 EDT 2011 | boardhouse
Hi Milroy, One thing to check is the FR4 Laminate being used - if this is a RoHs build is the correct FR4 being used by your manufacture. What layer count of board are you seeing the delamination on? Does you board shop Vacuum seal the packages wi
Electronics Forum | Fri Jul 08 12:45:10 EDT 2011 | markhoch
It's a $40 adder to my stencils if I have them apply it. But I've just discovered that if you have THEM add it, they add it thru a stencil and only apply it to the appertures. (My guess is they do this because it allows them to use much less material
Electronics Forum | Fri Jul 22 13:17:49 EDT 2011 | ehughes
I would be careful with trying Rain-X. Rain-X is a silanol treatment that is not durable. That is why you need to reapply it on a windshield many times. Also you could contaminate the paste as it will come off the stencil during the printing. From
Electronics Forum | Fri Jun 24 09:32:53 EDT 2011 | kahrpr
Looking at the appearance of pads and solder joint is pretty subjective. Especially lead free people are all over the map on the physical appearance of pads and joints. The true test is solderabilty testing, weather it’s just looking for good wetti
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