Electronics Forum: what (Page 1326 of 1843)

Re: Which SMD placement machines are easiest to use?

Electronics Forum | Wed Jan 26 12:48:56 EST 2000 | Wolfgang Busko

What does easy to use mean? From operators view: - simple input menue - precise error messages with suggestions what to check first - trustable feeders - low noise - feederchange possible without stop - automatic pickup-position alignment - safety fe

Re: what's your opinion

Electronics Forum | Thu Jan 27 20:32:01 EST 2000 | Dave F

Kyungman: So, your boss is trying to get you to put a wet paste inspection machine on your line after the printer. Sounds like you have a bunch of toys and someone wants to give you more!!!! Ah, the burdens some people have to live with!!! ;-) J

Re: Siemens 80s20 throughput !!

Electronics Forum | Fri Jan 21 19:27:54 EST 2000 | Scott S. Snider

With the Siemens line computer it is possible to see what the maximum placements per hours should be for any given job/setup. After you optimize the job you should check that and see how you perform against that number. In many cases the placements

Re: Paste Question!

Electronics Forum | Thu Jan 06 17:56:14 EST 2000 | Brian W.

I agree with Dave that passte volume is the most preferable criteria. However, you need to determine what you will accept and what your process is capable of. You need to define the process parameters, put procedures in place to control them, reduc

Should I manufacture my own boards or outsource them?

Electronics Forum | Sun Dec 19 23:27:22 EST 1999 | Mike

Should I manufacture my own boards or outsource them? Any opinions are welcome. I own a company and sell electronic products. Some products we sell have specific ad-on circuit boards which I have designed and had manufactured just for my company. The

Re: Solder Wetting

Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup

Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.

Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to

Re: Poor solder joints on QFP 100's

Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra

Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F

Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f


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