Electronics Forum | Fri Aug 20 14:22:02 EDT 1999 | Earl Moon
| | | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | | Can any one tell me what I have to change in my SMT | | | process (paste, reflow, etc) If any? | | | I
Electronics Forum | Wed Aug 18 14:33:40 EDT 1999 | Earl Moon
OK folks, let's get real serious. Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. Anyway, I said it would take another 4 weeks to develop a process
Electronics Forum | Wed Aug 18 15:09:48 EDT 1999 | John Thorup
| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop
Electronics Forum | Wed Aug 18 21:20:45 EDT 1999 | Dave F
| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop
Electronics Forum | Thu Aug 19 04:42:50 EDT 1999 | Earl Moon
| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t
Electronics Forum | Thu Aug 19 12:14:22 EDT 1999 | Doug Nebel
| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop
Electronics Forum | Wed Aug 18 11:52:35 EDT 1999 | Brian
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
