Electronics Forum | Tue May 26 11:13:49 EDT 2009 | xinxi
Is the components on the top or on the bottom of the pcb? Have you checked whether the temperature on pcb are too high when it pass through SW that it exceeds the limit that the components can take? Do check with the component manufacture for the te
Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist
Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different
Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
Electronics Forum | Tue Jul 07 12:50:33 EDT 2009 | davef
First, we don't know dip about nonbalanced squeegee. We clipped the above gif from: Solder Paste Printing Inspection: An Inside Look; E Litman, System Engineer, Orbotech; SMT January, 2004 Second, Tekscan talks about a product: I-Scan force and pre
Electronics Forum | Wed Jul 29 07:26:12 EDT 2009 | dilogic
Hi Patrick, thanks for the response. I might add some more information - we succesfully soldered some boards with the same settings of belt speed, pre-heat temp. etc. This batch of boards differs from the previous in a way that they are 4-layer. May
Electronics Forum | Fri Aug 07 09:53:12 EDT 2009 | kpm135
The Z-axis Drive card on our MPM UP2000 HiE fried. We replaced it with a new card, setting all the jumpers to match the old card. After that we had to recalibrate the Z-axis and the snugger height but the problem is that the camera is now too close t
Electronics Forum | Tue Aug 18 10:17:15 EDT 2009 | grantp
Hi, You don't need X-ray and all that crap. I would get an old MYDATA TP9 or something like that, and a manual stencil printer and a batch oven or a small inline oven. Should do the trick and be very low cost. Should be simple to use as well. Tha
Electronics Forum | Fri Aug 14 18:48:36 EDT 2009 | secura1
It's some time difficult to control process when > using a heat gun. What is the intent of using the > heat gun after test? we agree... the heat gun method was an experiment. We are planning to us a hot air re-work station. The intent is to re-
Electronics Forum | Thu Sep 03 12:03:52 EDT 2009 | Sean
Hi All, I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion? 2) I heard that lead fr
Electronics Forum | Fri Oct 09 13:37:55 EDT 2009 | tstrat
We are seeing similar issues. We have a board that consistently has failures on a BGA part. After SEM/EDS it was shown that the fractures were occurring between the Ni-P and Ni-Sn intermetallic in the ENIG finish. The element map showed elevated conc
