Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Tue May 29 12:35:36 EDT 2001 | genny
Dave, Sorry to drag this out some more. When I saw this thread I realized that we often get PWB's fabricated with a gold plated edge connector tab. However we have not ever given any specs to the fabricator regarding the gold plating - all we say i
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Thu May 10 02:57:03 EDT 2001 | kjellman
Hi, Why not have a look at Philips/Assembl�on, their ACM machine is quite nice. It may also bring you down to Flip Chip, 0201 some through hole and odd form placement. Nice options like bulk feeding, coplanarity tests, fluxing for FC, prom feeders (
Electronics Forum | Wed May 09 13:11:22 EDT 2001 | zam_bri
Hi.. Recently, I have received a few reels of 0402 with an old date code ( but still less than 2 years old).I don't have a capability in-house to carry out the solderability test except for the dipping test ( dip the components in the molten solder
Electronics Forum | Wed May 09 17:26:57 EDT 2001 | davef
Awww, don beso tuff on ursef!!! It sounds like you�re thinking correctly with what you�ve done, but it�s possible that the test you ran did not represent your actual production environment as well as you would have liked. So, you just need to "cran
Electronics Forum | Mon May 14 22:24:11 EDT 2001 | davef
The time over liquidous of the profile seems short. But then again, who knows? Based on what you told us, I'm guessing at a board fabrication problem, either measling or delamination. Probably the former, rather than the latter. [Now, we remember
Electronics Forum | Wed May 16 10:37:34 EDT 2001 | davef
Similar to my response to your previous posting on this topic dated 5/8/01, things to try are: 1 Contact your non-supplier [Streckfuss] using the contact points at http://www.streckfuss.com/wave_soldering.htm, obtain source drawings for components o
Electronics Forum | Thu May 17 22:41:05 EDT 2001 | davef
Hi Bob Still getting the cushy jobs, eh? [Tennent's and McEwans are two of my favorites. "Ahh, Beer! My one weakness...my Achilles Heel, if you will..." Homer J Simpson Quote 89/114] Under "Acceptable" for "Pin-In-Hole/Intrusive Reflow Inspection
Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef
What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked
