Electronics Forum: what (Page 1686 of 1843)

Re: Used Equip. Experience

Electronics Forum | Thu Aug 13 12:15:08 EDT 1998 | Mike Cox

| I am interested in hearing about people's experiences with buying used pick and place and stencil printing equipment. For example, was the cost saving worth the experience, was technical support available before and after the sale, did you deal dir

DFM Guidelines

Electronics Forum | Wed Aug 12 00:01:56 EDT 1998 | Peter

I have a customer who is transitioning from 100% thru hole boards to designing boards with smt components. We gave them our basic DFM guidelines and they have laid out 2 boards following these guidelines. When I saw the result of their first pass, I

Re: Solder paste matrix

Electronics Forum | Mon Aug 10 21:41:31 EDT 1998 | Dave F

| What exactly is the criteria needed to determine the right solder paste. I have been fortunate enough in the past to have a solder paste work "halfway" for me and to modify the reflow profile or simply just "drop in" a paste and monkey with the pro

Re: Gold boards OK with SMT?

Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon

| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele

Re: Solder Spotting on Gold

Electronics Forum | Thu Aug 06 13:09:57 EDT 1998 | Bob Willis

| Bob | I have had problems with spotting on gold contacts for many years and have spent many hours working on ways to solve this problem. Once a source of the problem is found and corrected the next month another source will crop up (new operator o

Re: STENCILS

Electronics Forum | Thu Jul 30 14:16:32 EDT 1998 | Phil Crane

| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU

Re: STENCILS

Electronics Forum | Sun Aug 02 06:54:26 EDT 1998 | Bob Willis

You may liketo contact Chemtech in the UK. http://chemteck.co.uk as they have a new hand book on stencils and a design guide due for release shortly there is also some stencil information as a survey on types and price on my web sites under surveys h

Re: Pin in hole process problem

Electronics Forum | Tue Jul 28 16:13:45 EDT 1998 | Steve Gregory

| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman

| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und

Tape and shunts are good ideas for WS *BUT*...

Electronics Forum | Tue Jul 28 07:02:59 EDT 1998 | smd

Right now we are taping the goldfingers which is effective but also expensive. Also, some tape was leaving yellow marks on the goldfingers. We're trying the so-called goldfinger glove from Steven's Products. It's a very small company (probably one gu


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