Electronics Forum | Mon Aug 02 11:49:02 EDT 2004 | jbabson1
Blind vias are just that. They do not show on the surface sides of the pwb.
Electronics Forum | Fri Jul 30 16:12:12 EDT 2004 | davef
Search for "SMT Terms and Definitions" in the "Library & Bookstore" tab in the light blue area on the left of your screen.
Electronics Forum | Tue Aug 03 08:38:42 EDT 2004 | davef
Conductive epoxy is usually specified as less than 6:1 aspect ratio fill capable, while non-conductives are 10 to 14:1 (depends on which brand and who you ask).
Electronics Forum | Tue Aug 03 14:46:25 EDT 2004 | russ
We recommend to the designers "the smallest diameter that you can get away with", that will help reduce the solder scavenging into via diring reflow. unless you are planning on having them filled as Dave F mentioned. Russ
Electronics Forum | Sun Aug 01 11:27:40 EDT 2004 | haran
What is the best epoxy attachment method for Heat Sink?The operator always miss the solvent dispensing application prior to epoxy dispense which cause the heatsink falling off at customer site as well as in the factory?Any advise?
Electronics Forum | Sun Aug 01 11:31:59 EDT 2004 | Andrew
How do you define torque setting for screw?What does 1)Screw with Bolt size 3-48 means ? 2)Thread Size M3 means? 3)Fasterner Property Class?
Electronics Forum | Thu Aug 05 11:51:46 EDT 2004 | Dhanish
So are you saying there is no way the vision system will accept the part if there is problem with feeder or nozzle?In what case,misalignment can happen before reflow process?
Electronics Forum | Thu Aug 05 17:26:21 EDT 2004 | russ
What happens to the flux and pads on the second side of a double sided board during the first reflow? It seems to me like the solder would dome and the flux would be used up and migrated to other areas. Russ
Electronics Forum | Wed Aug 04 11:34:00 EDT 2004 | Rafal M.
Hello! My problem are solder balls in normal (with Pb) wave soldering proces. Balls appears between connector pads. I tried to change fluxes and preheating in machine (and combinations of both). What else can I do? I have no wide experience in solder
Electronics Forum | Wed Aug 04 16:49:24 EDT 2004 | jim_bob
Regarding Lead Free component finishes, vendors are zeroing in on matte tin plating as the finish of choice. What test are performed, to determine if a finish is "matte" type (vs. non-matte)?