Electronics Forum | Mon Jul 12 13:27:35 EDT 1999 | Upinder Singh
Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry standards for uBGAs and of wha
Electronics Forum | Mon Jun 28 13:34:06 EDT 1999 | Scott Cook
| Hey Scott, | | Good posting. However, what test did you perform and what was the nature of your technology? Both ionics (SMD600) and SIR on RF product to the 3 Gig range. Power amps and Xceivers. Technology was mixed; double sided SMT. My bare b
Electronics Forum | Wed May 19 21:08:07 EDT 1999 | Omat Marasigan
hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... your help is greatly appreciated...thanks omat marasigan
Electronics Forum | Thu Apr 22 11:44:30 EDT 1999 | Chrys Shea
| I would like to known what�s MESH SIZE mean in the solder paste specification ? | | Check out the thread from 4/14/99 on solder FINES vs. solder balls. The info you're looking for is in there.
Electronics Forum | Fri Apr 23 12:09:47 EDT 1999 | JJA
| | I would like to known what�s MESH SIZE mean in the solder paste specification ? | | | | | Check out the thread from 4/14/99 on solder FINES vs. solder balls. The info you're looking for is in there. | test
Electronics Forum | Tue Mar 16 21:04:41 EST 1999 | Clint Meech
What are TSOPs?? Are they particularly susceptable to moisture? Should they be baked prior to placement? If so, at what temperature? Do require special storage environments? Any advice, would be greatly appreciated. Thanks, Clint.
Electronics Forum | Mon Mar 01 09:03:51 EST 1999 | George Verboven (Process Engineer)
It seems to be that we have to much NaCl left on our assambled PCB's. The flux we use is from cobar. They say it can not be from the flux... So what can be the reason, what kind of problem may occer when there is to much NaCl.
Electronics Forum | Wed Feb 24 16:15:50 EST 1999 | Justin Medernach
Fab Gurus, (Earl) What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. Thanks, Justin
Electronics Forum | Wed Feb 10 15:49:53 EST 1999 | Gary Sickenger
Helo, Is it common for actual print height of solder paste to exceed the stencil thickness. For example If the stencil is 6mill thick and the actual height of the print is apx. 10 or 11mill. What causes the paste height to be greater than the sten
Electronics Forum | Mon Feb 08 09:16:32 EST 1999 | Mario
What did you guys do to our forum? I do not want the 5 five I want a listing of all in the last 5 days min. More and more it seems that this site getting a little less user friendly!
