Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Fri Dec 08 21:36:42 EST 2000 | reg
Hi everyone!! I have less than one year in the US, and I had been working as a field smt engineer. I have almost two years of experience as a manufacturing engineer, but what I really would like to do is process engineering. Can somebody advice
Electronics Forum | Thu Dec 07 11:38:04 EST 2000 | Dason C
Please advsie what kind of the solder paste which you are using and we have experience when using Alpha WS609 and found a lot of foaming. Beside, are you using the spray fluxer for your wave or not? If you have spray fluxer then you don't need to u
Electronics Forum | Thu Dec 07 14:22:54 EST 2000 | NickMata
The pattern does mater with respect to whether they are single or dual dots. From info which I have collected, dual dots would be an issue for the FUJI since they are capable of viewing one or the other as a fiducial but not both at the same time. W
Electronics Forum | Thu Nov 30 21:23:44 EST 2000 | Dave F
Design more products and get wealthy. Don't waste your time and energy in areas that others are accomplished. A friend designs boards, sells $10M [what that is in euro, funny money, I don't know or care] of them a year, with a company of five [in
Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K
Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with
Electronics Forum | Mon Nov 20 06:51:00 EST 2000 | Daniel Carlsson
Does anyone have information regarding: -Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are ther
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Thu Nov 16 18:19:10 EST 2000 | Dave F
We want to improve our process for accepting SMT solder paste stencils received from suppliers. Our process: * E-mail CAD aperatures to supplier with "readme" giving specific fabrication instructions to the supplier. * Receive stencil from the suppl
Electronics Forum | Tue Nov 21 15:49:01 EST 2000 | CAL
Dave- this may not be much current help but for future needs: IPC-7525 Stencil Design Guidelines is due out real soon. Check with IPC on its status, last I heard it was in interim Final.What is nice about this Doccument is that it also covers Pin_Thr