Electronics Forum | Fri Apr 23 11:42:30 EDT 2004 | patrickbruneel
Thanks for the answer. what i believe happent is that the manufacturer of the paste reduced the tackiness of the paste to eliminate the squeegee sticking problem, and now with the reduced tack its a lot easier for the powder particles to break off du
Electronics Forum | Thu Apr 29 14:41:12 EDT 2004 | pjc
OK if the paper is transparent and you can adjust the table X-Y-Theta under the paper- without moving the paper - the align with the solder lands on the board. If you have a DEK or MPM machine, the Mylar frame is like $300. I belive other printer mfr
Electronics Forum | Wed May 05 01:42:06 EDT 2004 | fastek
Kuru- If you have a bad tactile sensor....find out what the part number is and you can order it from MPM. If you don't have the part number, MPM won't help you unless you pay a price to register the machine. You're other solution is to post an ad on
Electronics Forum | Tue Apr 27 12:01:10 EDT 2004 | Dreamsniper
Hi, Can anyone help me as to what is acceptable and reject when it comes to solder balling under BGA's? I've got some BGA's with solder Ball but they seemed to be attached and they are about 10% of the size of the actual soldered BGA joint size. Our
Electronics Forum | Wed Apr 28 12:10:14 EDT 2004 | paul_bmc
Are your solder balls after reflow a perfect sphere or are they oblong, like chushed. I know a heavy bga or incorrect reflow profile could cause bridging. Also too much flux paste. Sometimes what we do is brush the flux paste onto the pcb pads inst
Electronics Forum | Wed Apr 28 15:08:10 EDT 2004 | russ
This could be a long shot but here goes. I have found that if flux is applied in excess that it will actually "move the solderballs" during reflow. I have actually seen where the balls are completely outside the package and oviously there are short
Electronics Forum | Mon May 03 16:36:08 EDT 2004 | Kris
Try getting a small contract manufacturer who will build the boards for you initialy that way you can learn untill you establish the process once you do that you can have a fair idea of what machines to buy ? where to buy ? or maybe if the volumes
Electronics Forum | Fri Apr 30 11:18:23 EDT 2004 | Bryan She
These days I've met much CSP fails.it's .5mm pitch,5x5mm outline CSP.we must reball it and mount it again on the boards because these Parts are very expensive and we can't scrape it off.is there anyone has any precieus experience or suggestions?or wh
Electronics Forum | Tue May 04 22:45:58 EDT 2004 | alwil
I want to find out if we can place 0201 components using a Fuji CP6-E 4000. If this is possible, do we require any upgrades to the machine. Is anyone doing this at present with this type of CP6. If so, what size of nozzle and feeder type is being use
Electronics Forum | Wed May 05 17:18:38 EDT 2004 | davef
It's a Furukawa proprietary material. 'Google' on just the 'EFTEC 64T'. [Sometimes it's Cu EFTEC 64T, copper EFTEC 64T, sometimes just EFTEC 64T.] For instance, Table 5-2 in: http://developer.intel.com/design/packtech/ch_05.pdf
