Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris
What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(
Electronics Forum | Wed Jan 26 20:52:06 EST 2005 | Chua
Hi, I'm going to evalute new solder paste and flux for wave-solder. Appreciate you could advise what are the things need to look out during the evalution. Any recommend step or proper way of doing solder paste and flux evalution. Appreciate your he
Electronics Forum | Thu Sep 23 08:08:12 EDT 2021 | SN
Hi. Anyone in this forum experienced the lead-free solder paste SAC305 and SAC405? What are the differences to expect for solder paste with SAC305 and SAC405? What is the effect of silver (Ag) alloy in solder paste? It was really appreciated if could
Electronics Forum | Thu Oct 02 17:00:44 EDT 2008 | davef
Is that accurate? If so, what are your aspect & area ratios? [Similar to the JerryS comment above.] * You say, � � and the average height is very high: nearly 200 pct.� => Our troop can make paste that height too. They snap the stencil-off a fast as
Electronics Forum | Wed Jun 01 13:29:34 EDT 2022 | emeto
It is almost like attempt to advertise something or dig into market opinion for future development of something. In both cases looks like scheme - not clear what they ask for, not clear what they want to achieve.
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Thu Oct 02 01:47:57 EDT 2008 | myleb
I'm new to SMT. Now, i'm making program for SPI machine to inscpect for solder paste of SP60-MU. I think this is a very good printer but some times, my program shows only 50-60% of volume transfer; and the average height is very high: nearly 200 pct.
Electronics Forum | Tue Jun 01 17:37:34 EDT 2004 | lynnmc
Any view on what the minimum reflow temperature is for a SAC ball bga to form a reliable joint with PbSn solder?
Electronics Forum | Tue Oct 05 12:46:02 EDT 2021 | emeto
From what I understand SAC305 and SAC405 are considered low silver content and have the better overall mechanical qualities compared to more silver or no silver.
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
