Electronics Forum: white (Page 81 of 92)

wave solder bean bags

Electronics Forum | Wed Aug 09 09:25:57 EDT 2006 | Mike F

Am I missing something here? I usually put some type of stiffener or support on the leading edge to make sure the PWB doesn't sag in the middle from the preheat. If I had to add a bean bag with shotgun pellets or BB's I would have boards falling out

Solder mask discoloration

Electronics Forum | Wed Aug 17 13:57:27 EDT 2005 | ppwlee

We have encountered what appears to be mask discoloration after wave soldering. The areas of concern coincide with the areas that were exposed selectively by fixtures during wave soldering, dominated by one date code of PCB with a slightly different

Reflow Oven Selection

Electronics Forum | Sat Aug 27 12:45:44 EDT 2005 | Mark

Thanks for the replies. Interesting white paper. Didn't quite answer my concerns but still a good read. I was actually surprised that to test temperature uniformity across the zone, they attached T/C's to the substrate rather than measure the ai

Lead free component VS vision on Mydata MY12

Electronics Forum | Wed Nov 09 11:01:41 EST 2005 | DannyJ

Hi Red and Greg, First, to Avalancher, the service that is mentioned is fantastic. I have used it various times with various connectors and headers with fantastic results. Just contact MyData and they'll tell you what they need. It's usually 5-1

Necessity of ROSE in commercial quality processes

Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS

3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir

Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers

Hitachy QFP 256 leads problems

Electronics Forum | Tue Mar 20 00:02:00 EDT 2007 | Darby

Some causes of skewing. If you have exhausted all mechanical problems for that head. Pickup data from tray is incorrect. If you aren't picking up in the exact centre it is possible that the component is being skewed after vision adjustment i.e. cent

Pattern matching type fiducial at Topaz/ Emerald machines

Electronics Forum | Sat Mar 24 07:07:52 EDT 2007 | stefi

Hi, Thanks for the reply, The fiducial which posed problems is a 1 mm diameter gold plated circle fiducial. The problem with this is that the vision system sees it darker than the surrounding area. The surrounding area is all copper covered with th

Kyzen or Zestron?

Electronics Forum | Thu Jun 07 08:55:01 EDT 2007 | grics

Well... Some are worse than others... How can you identify that it is caused by uncured mask and not flux residues? The flux is from indium, 3592. Some research in their tech library revealed that either Kyzen or Zestron would work, which is the re

CSM Technical Question

Electronics Forum | Thu Oct 11 09:01:04 EDT 2007 | actech

Jon, Thank you for your input, I think you may be correct in that the Brd./Comp. of Fid data may not be correct any more. The unit was caught up in a flash flood just high enough in our facility to get the processor board. After cleaning and drying a


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