Electronics Forum | Wed Jan 27 19:42:34 EST 1999 | parag palshikar
i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperature a
Electronics Forum | Mon May 26 11:02:17 EDT 2008 | jandon
Hi Mr. Necdet Ozyonum, Recently we did have same kind of problems when we use lead free reflow profile for leaded solder paste (AIM WS-483). There where solder resist lacks, we found white residue after aqueous cleaning. Not in the solder joints but
Electronics Forum | Mon Apr 29 10:42:47 EDT 2002 | Jim M.
I had problems with white residues on both WS609 and WS 3060.The WS 3060 turned out to be a carbonized material.The composition after analysis (Energy Dispersive X-ray spectrum) turned out to be tin,tin,phosphore and cloline and tin. Alpha also have
Electronics Forum | Sun May 25 10:30:31 EDT 2008 | necdetozyonum
Dear All, I would like to take your opinion about the result that we have faced after cleaning the PC assemblies in a cleaning machine (Miele Dishwasher) with the cleaning detergent Qualitek Everkleen 1005. We use DI water for cleaning purpose in t
Electronics Forum | Wed Apr 24 21:27:10 EDT 2002 | davef
50�C. * Boards are too hot to be cleaned. Yes, saponified cleaners will remove heat decomposed WS flux. Well, I suggested changing paste to another poster, because he mentioned overheated solder connections and I guessed that his white residue was
Electronics Forum | Mon May 26 08:59:32 EDT 2008 | davef
It's possible that the flux residues from the solder paste used in your SMT process is not compatible with your water wash process. For instance, some no-clean fluxes leave resudues that are not water washable. When these residues are washed, they de
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).