Electronics Forum: why start with bottom side (Page 1 of 4)

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 10:29:10 EDT 2007 | ed_faranda

Is there a reason why you want to wash the board before wave?!?!? What is your process flow? I run bottom side of my boards first, then top just to make it easier to setup (easier to put those support pins around those smaller components). But,

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 10:57:12 EDT 2007 | babe7362000

Is there a reason why you want to wash the board > before wave?!?!? > > What is your process > flow? > > I run bottom side of my boards first, > then top just to make it easier to setup (easier > to put those support pins around those smaller

Where to start with a new reflow oven

Electronics Forum | Mon Oct 13 13:34:13 EDT 2003 | caldon

HI Andrea- to answer Q: 1) Stencils can be order through various vendors that manufacture stencils. You would need to have CAD data for the Stencil company to make them. You design engineer should have the CAD info. Also, the stencil design company c

Hall IC Placement (Support with PWB Carrier)

Electronics Forum | Thu Mar 06 09:34:56 EST 2003 | msivigny

Hello Joseph, I'll be honest, I'm finding it a bit difficult to understand and visualize the complete scenario. If this component is designed for surface mount placement into a slot on a PCB, then why does it even need support from the bottom side? I

Re: Experience with solder stop on components?

Electronics Forum | Tue May 04 10:38:24 EDT 1999 | Dave F

Does someone has experience with solder stop on components to avoid an Viking effect (no solder on the pad, all solder on the lead)? What kind of solder stop does work well? What is dangerous? What has to be kept in mind when using such components?

100nF 0805 ceramic cap with 25 Ohm resistance? Why?

Electronics Forum | Fri Jun 25 00:16:11 EDT 2010 | leadthree

I got a report from Yageo yesterday with microsections and and and..... result: Cracks I did a test run on boards after ICT, but before coating. They are all ok. Seems the cracking happens somewhere after the ICT. But at that stage all assembly is a

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F

I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the

Solder flow thru via on pad

Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef

Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the

Re: Repair of SMT boards...a question!!

Electronics Forum | Mon Jun 07 10:57:31 EDT 1999 | Dave F

Where I can find some informations about repairing of SMT boards? Thanks Marcos A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures.

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

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