Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
Electronics Forum | Sat Nov 11 11:27:51 EST 2006 | Tom
Hi, "glass wicking failure" we don't know what this is, but we suspect that the reflow process could very well be the root cause for some of our pcba with micro vias failure. Micro vias pcb we know to well (we don't like them at all). There are No p
Electronics Forum | Mon Oct 03 11:33:09 EDT 2011 | artposada
I have been getting solder balls on the leads of a transformer that I am soldering to my pc board. My parameters are listed below. The board PTH's are .039 The transformer leads are .0255 square. My solder pot temp. is 310C Solder is Lead Free AIM
Electronics Forum | Tue Jan 27 10:31:14 EST 2015 | dbrazel83
We have a surface mount connector from Hirose that has two through hole mounting pins on the side. The solder is wicking up the pins into the body of the connector during reflow, even with adjustments to the PCB solder mask which came directly direc
Electronics Forum | Tue Jan 27 10:52:22 EST 2015 | dyoungquist
Taking a shot in the dark...... Are you using the correct oven profile for the connector? Solder tends to flow (wick) towards the hottest part of the connection/pin/pad it is on. It may be that the hottest part is the connector itself where the pi
Electronics Forum | Wed Jan 31 10:56:23 EST 2018 | dontfeedphils
I'm working on bringing up a new conformal coat process/workcenter and have a few questions I'm hoping someone might have experience with. Right now we're manually spraying both coating materials (1B31 and 1A33 from Humiseal) using HVLP guns. I run
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Mon Nov 20 05:45:39 EST 2000 | Daniel Carlsson
Hi! Some varibles that I would think increase the risk: -The use of Nitrogen when soldering. -The use of IR may cause thermal vias (if placed only on one "side") to produce uneven heat distribution and thus wick the comp. -Uneven heat distribution.
Electronics Forum | Tue Oct 17 14:40:04 EDT 2000 | Glenn Robertson
Jason - I have only one thing to add to Dave's excellent (as usual) information. Some time back we had a similar problem and we removed the dross bits with a soldering iron and solder wick. Yes, it's tedious and you have to look closely to be
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
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