Electronics Forum: wire bonding (Page 1 of 20)

clean rooms/ wire bonding

Electronics Forum | Mon Mar 07 15:41:50 EST 2005 | John M

Is anyone aware of standards which would identify the clean room requirements for the wire bonding process ?

gold wire bonding

Electronics Forum | Wed Dec 28 03:33:31 EST 2005 | sparrow

I would like to know if ENIG is widely used for the thermosonic gold wire bonding or this application is an exotic one. And I also wold like to talk to someone who uses printed circuits with ENIG finish for such an application. I do not quite underst

clean rooms/ wire bonding

Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI

It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w

gold wire bonding

Electronics Forum | Tue Dec 27 10:00:19 EST 2005 | sparrow

Hello, does anybody have experience in thermosonic gold wire bonding to electroless nickel/immersion gold?? regards, Sergey

gold wire bonding

Electronics Forum | Wed Dec 28 21:18:12 EST 2005 | davef

You don't TS bond gold wire to nickel [of ENIG] for the same reason that you don't TS bond gold wire to hard gold. [Nickel or maybe cobalt is used to harden soft gold.] Together nickel and gold produce unreliable bonds. Look here: * http://www.smta.

Aluminum wire bonding

Electronics Forum | Sun May 26 10:21:46 EDT 2002 | V.RAMANAND KINI

We buy PCBs for aluminium wire bonding. Our PCBs have 0.25 mm square pads for bonding and 0.10 or 0.15 mm gap between circuit traces/tracks. We do not have any problem. Our vendor gives 9 microns of Nickel and 0.03 microns of gold.

gold wire bonding

Electronics Forum | Tue Dec 27 14:51:49 EST 2005 | davef

What's the issue and situation?

gold wire bonding

Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow

Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w

gold wire bonding

Electronics Forum | Fri Jan 20 10:27:22 EST 2006 | sparrow

Hello David, No, the capillary does not scrub through the gold layer. At least, we have never seen it. We replace the capillary after approx. 200k bonds. Regards, Sergey

gold wire bonding

Electronics Forum | Sun Jan 22 20:45:24 EST 2006 | yihui

Hello Sergey, thanks for your input. The capillary i'm using seems to pick up material from the bond surface fairly quickly. Can't think of a solution at the moment. regards, david.

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