Electronics Forum: wire tinning visual standards (Page 1 of 2)

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef

What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC

Blue color in solder bath and tinned lead

Electronics Forum | Thu Mar 10 10:06:08 EST 2005 | steve

OK all you Gurus here's one for ya. Customer is tinning wires with standard eutectic solder in a solder pot. There is a blue tint to the solder in the pot. After tinning with OA flux, which I will change to NC shortly, he has clear teflon insulation

Soldering to a nickel plated battery terminal

Electronics Forum | Tue Apr 22 12:33:35 EDT 2014 | barryg

No we have a battery spring that is soldered directly to a PCB (standard tin plated copper PCB). The Battery spring supplier (and I have no confirmation he makes them or buys them) claims they are tin plated. When trying to solder to them it is very

Soldering wires to through holes

Electronics Forum | Wed Dec 07 17:43:31 EST 2011 | mikenil

Hi I do not work for a board house but a manufacturing facility where we do a considerable amount of soldering wires to through holes. We pretin our through holes on both sides of the PCB prior to reflowing the solder and installing the conductor (w

Low Melt Solder Chemistry for use in Rework Process

Electronics Forum | Wed Feb 07 16:20:46 EST 2007 | davef

Bismuth is a low-melting metal with poor mechanical properties; if you melt the bismuth wire into a standard tin-lead solder joint, then the bismuth alloys with the solder, and forms a material that will crumble if you scrape it with your fingernail.

Gold Thickness

Electronics Forum | Fri Jun 09 12:51:52 EDT 2006 | flipit

You can not solder to 30 micro inches of gold over nickel and certainly not 80 microns. You can not with tin lead solder or SAC305 anyway. The upper limit is between 6 and 10 micro inches of gold. This is what ENIG plates to. If you solder to gre

Solder Spotting on Gold

Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis

This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder

cold joint on 1 lead of IC

Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval

A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'

BGA inspection scope - Visual

Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper

Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

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