Electronics Forum: wire-bond (Page 1 of 17)

Wire Bonding

Electronics Forum | Wed Mar 25 09:01:09 EST 1998 | Harvey Grossman

What is the recommended finish for wire bonding ? Type of AU, thickness, etc. thanx...

clean rooms/ wire bonding

Electronics Forum | Mon Mar 07 15:41:50 EST 2005 | John M

Is anyone aware of standards which would identify the clean room requirements for the wire bonding process ?

Wire Bonding

Electronics Forum | Sat Jan 21 12:18:53 EST 2006 | theSaint

What is wire bonding? What are the applications?

Aluminum wire bonding on ENEPIG plated PCB

Electronics Forum | Tue Sep 10 10:42:36 EDT 2013 | capse

Plasma cleaning is used extensively to clean surfaces prior to wire bonding.

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef

Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service

DCA/Wire Bonding/Encapsulation

Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David

Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?

Au Wire bonding failure

Electronics Forum | Wed Dec 14 12:34:56 EST 2016 | cy4223111

Hi all, Recently, we are trying to do wire bonding between a 75 * 75 um pad on a chip and substrate with 150 um height difference, but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef

Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con

Plating for aluminum wire bonding

Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef

Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef

Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the

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