Electronics Forum | Fri Jun 03 14:31:33 EDT 2005 | Peter
I am working on an application requiring removing BGAs from a board coated with parylene. These BGAs have low standoff with less than 0.015" after SMT soldering. Can some comment on a reliable and consistent process to perform such rework? given tha
Electronics Forum | Thu Jun 09 11:07:31 EDT 2005 | vikkaraja
I work for a rather large company. what job title do I fit in? My current title is maintanence Tech. III. What do I look for, beacause maintanence is a very broad term. I do fuji Flexa programming, Fuji smt reapair troubleshooting, MPM solder print
Electronics Forum | Mon Jun 13 09:23:54 EDT 2005 | russ
I agree with Dave on the Water soluble process for this part. It is interesting that I have yet to find a Water Soluble for lead free that works. I have experienced a lot of problems with the flux on these pastes, wetting, solder balls, etc... kind
Electronics Forum | Thu Jun 09 12:21:07 EDT 2005 | ratsalad
James, I have worked at a couple of different companies and both have reduced their changeover times significantly. What type of placement machines do you have? Do you use customer part numbers or do you have your own internal part number for co
Electronics Forum | Thu Jun 09 12:23:23 EDT 2005 | davef
If your boss can't figure-out that buying feeders is cheaper than having a machine idle, then it's good that he has time available to torment you on why you're not developing other solutions. On the other hand, if you don't have enough work to load
Electronics Forum | Mon Jun 27 15:02:55 EDT 2005 | cmiller
Thanks for the reply. I had the instructions out of the manual but after re-programming we had all kinds of wierd stuff going on. After re-setting the PC several times it worked fine. Can I get a copy of the instructions you have? It would be appreci
Electronics Forum | Wed Jun 15 13:47:28 EDT 2005 | russ
No you're not stupid, they will melt if the top of the board gets real hot. I was lucky most likely in that ours were usually off of the board surface. anything that will hold the weight material will work. Now that I think about it my shot bags w
Electronics Forum | Fri Jul 15 13:58:32 EDT 2005 | seaK
Our production is putting QFN40 and QFN56 package on board. With 80% opening on terminal, 40% on thermal pad, we found QFN56 100% forming toe fillet, but it does not work out the same to QFN40. We suspect it's because of the weight of component.....
Electronics Forum | Tue Jun 28 09:39:00 EDT 2005 | davef
Points to consider are: * Gold plating too thick [SB LT 8 uinches]. [Obviously, we're talking about actual plating thickness, not the specification.] * Reflow recipe improper [SB 220*C 5-10 sec]. A recipe that works fine for HASL needs to be hotter
Electronics Forum | Wed Jun 29 03:37:53 EDT 2005 | lupo
Hi, I think that the time depends on the type of stainless steel, temperature and solder alloy. For example, one of our machines is delivered with 316 stainless pot and alloy SnNi. It worked six months (120days*16hours = 1920hours) and aft
