Electronics Forum | Fri Apr 11 11:26:09 EDT 2003 | Brian W.
Cracked capacitors usually are not found at ICT. Unless the cap is completely cracked, the capacitance may not change much, and the usual failure mode is a leakage current. This is usually only seen in ESS type testing, when temperature and humidit
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Sat Apr 26 20:27:18 EDT 2003 | LWEI
I'm working on a protobuild for a pcba. THis pcba uses double-reflow, paste-in-hole process. On bottom side there is a Ceramic BGA, size 35 X 35 mm, thickness 6mm, over 900 balls count (ball pitch 1mm)and it weighs a hefty 20 grams. Printing uses 6 m
Electronics Forum | Mon Apr 28 09:34:37 EDT 2003 | davef
Double sided weight of component to total pad mating area ratio: 30 gm per sq inch (50 mgm per mm2) Go to the sites of these consultant-people for additional background [I'm not sure exactly where on these sites to look, but both are laden with goo
Electronics Forum | Fri May 02 12:41:16 EDT 2003 | Chris Lampron
Hi Chris, I had worked for a flex circuit house for 10 years. You should be able to follow your solder paste guidelines for times and temps. You may want to consider pre-baking the flex if it is made with Kapton. Kapton is Hygroscopic and will delam
Electronics Forum | Fri May 09 10:29:23 EDT 2003 | k_h
72 different part numbers, 53 being 8mm, remainder being 12-44mm and 3 tray. It may be low but anymore than 100 and you give up throughput because of feeder locations. And thinking about it, 70-90 is low for a low volume high mix line. I guess if I w
Electronics Forum | Mon May 12 10:14:04 EDT 2003 | gregp
Hello Stefan, Thank you for your reply. I see now that manufacturers are aware that this kind of thought process is necessary for the bottom line profit. It is also true that one can be "seconds wise and minutes foolish" in the process. I read with
Electronics Forum | Tue May 20 11:09:30 EDT 2003 | JB
Hello Gav, We have tried the procedure that you described, and it didn't work well for us. Even though the viton tubing is doubled up and pinched, no amount of glue is visible at the tip of the tubing. So getting the glue to protrude from the syring
Electronics Forum | Mon May 19 18:10:43 EDT 2003 | msjohnston
A chemical change is needed to reduce VOC�s in our spray-in-air stencil cleaner. Items that are to be considered to effectively find a replacement chemical that works as well, or better than the current chemical include, but not limited to, the foll
Electronics Forum | Thu May 29 14:21:22 EDT 2003 | swagner
Thanks for the clarification, I have worked with both application, especially pre reflow. The data you should consider collecting pre reflow is missing, skew degrees, x,y shift, bill boarding, polarity and match the failure data (ref. desg.) to feed