Electronics Forum | Mon Nov 02 17:14:52 EST 1998 | Thomas Clift
Thanks for your reply. I am interested in knowing about maintenance schedules and levels. I'm wondering how to know if I must replace a part. What part? What type of lubrication (for Fuji). Etc. My company is small in terms of number of lines and th
Electronics Forum | Mon Oct 26 11:11:48 EST 1998 | John Hardy
We have installed a Sonoflux atomized mist fluxing unit (Model 9500)on our Future 1 wave solder machine. We are concerned that the retrofitting of this unit may not have been appropriate for our equipment, as we are now experiencing many problems wi
Electronics Forum | Fri Oct 23 09:29:29 EDT 1998 | Allen
We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good but
Electronics Forum | Fri Oct 23 14:58:40 EDT 1998 | Dave F
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
Electronics Forum | Tue Oct 27 09:57:37 EST 1998 | Dave
I completely agree with what Dave said previously about the trimming process. I spent the first 6 months at my current job removing this process from our assembly floor. We had several problems with the process including: 1) "flags" from the leads
Electronics Forum | Wed Oct 21 16:48:38 EDT 1998 | Cunli Jia @ SMTnet
| To All at SMTNet: | | Got the flyer in the mail yesterday, Great Job! | We will see you at the IPC/SMTA show next week. Wayne, Thank you for the comment. I am glad you like it. Sorry we have decided not to come to the show for lack of time.
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Mon Oct 19 23:37:16 EDT 1998 | john godfrey
| | I AM LOOKING FOR INFORMATION ON A WAY TO REPAIR STENCIL FIDUCIALS TO KEEP THEM SOLID AND AS DARK AS POSSIBLE.SOMETING THAT WOULD BE MORE OF A PERMANENT SOLUTION,I HAVE USED PERMANENT INK BUT IT EVENTUALY WIPES OFF OR FADES... | | | Don't laugh,
Electronics Forum | Thu Oct 15 21:19:21 EDT 1998 | Scott McKee
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte
| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc
