Electronics Forum | Tue Apr 13 13:45:26 EDT 2004 | arcandspark
Ken you say reaching 218 to 221 C will give a homogenus solder ball. The pb free solder balls on the BGA reflow at 235 C to 238 C but I have seen when you combin to differnt types of solder say 63-37 and 10-90 you will atually lower the melting point
Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o
Electronics Forum | Wed Apr 21 18:24:13 EDT 2004 | pjohnson@volterra.com
Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This w
Electronics Forum | Thu Apr 29 16:58:00 EDT 2004 | pjc
You should be able to get a one-print Mylar frame for the SMTech 90 machine from SigmaPrint, http://www.sigmaprint.co.uk Yes, with vision you store images of two features such as solder lands or fidicial marks from opposite corners of the board. With
Electronics Forum | Thu Apr 29 10:35:31 EDT 2004 | dougt
Start with a load cell (force sensor), you will need one that can handle the force range you will be placing. Someone please correct me on this if I'm wrong but I seem to recall that placement force runs in the range of a couple hundred grams. Chec
Electronics Forum | Thu Jun 17 16:25:06 EDT 2004 | kmccarten
Rob; To answer your question regarding the availability of moisture controlled dry storage cabinets (Dry cabinets), yes such animals do exist. You can find some additional generic information regarding dry storage cabinets for the electronics envir
Electronics Forum | Thu Jun 10 16:23:11 EDT 2004 | davem
Hi Grant, In previous positions I've had experience with the Fuji CP43, CP6, CP642, CP643, CP65, IP3 & QP242. In operating, training and process engineering capacities. Presently, I'm working with 2 SMT lines (in a process engineering capacity) wit
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Fri May 28 15:03:34 EDT 2004 | jaytorres
Wierd thing happened today with the HSP4791. All the programs and component definitions were wiped out (luckily they are all backed up on the terminal). And since the air compressor was shut down today to change the oil in the compressor, the 4791
Electronics Forum | Tue Jan 17 17:28:47 EST 2006 | adlsmt
I would agree that anyone buying a new machine should run boards on it. As well I agree with almost everything you said. We did run boards on a Mydata machine. If we were shorter runs and higher mix I would have bought one. We paid a local comapny a
