Electronics Forum: works (Page 961 of 1069)

Topside Heat on Board

Electronics Forum | Fri Jun 02 12:18:47 EDT 2006 | Vince Whipple

Marc, Topside temperature is one of the most critical parameters for a successful solder process. Temp stickers are OK to use but won�t tell you the temperature in tight areas. The temp gun like Jay suggested is what I use as a quick indicator. (Rayt

Poor soldering on fine pitch?

Electronics Forum | Wed Jun 14 11:37:44 EDT 2006 | shawnvike

find the problem? Were the parts failing > electrically? Or did someone start prying them > and decide they were too weak? Originally found the problem going through some older assemblies that had failed testing. Poked at leads and found them no

Problems with SN100C in a Soltec Delta C Wave

Electronics Forum | Fri Jun 09 20:13:36 EDT 2006 | grantp

Hi, We have spent the day trying to profile our Vitroncis Soltec Delta C wave with the new SN100C solder, but having problems with the heavy pins on some BNC connectors we are using. We have Interflux no residue flux, and we are using palettes, whi

Problems with SN100C in a Soltec Delta C Wave

Electronics Forum | Fri Jun 09 22:22:59 EDT 2006 | grantp

Hi, Very funny, and I feel so much better not because of your advice, but because your a Dr Dr PhD, and we all know thats more important than experience! Seriously though, so you think we should be ok with the zones we have? We are not sure, and so

RoHS petition

Electronics Forum | Tue Jun 13 10:23:54 EDT 2006 | patrickbruneel

Hey Rob don't give up yet let your voice be heard, the fat lady didn't sing yet!! Grant, you wrote "I think it's easy to be pro RoHS because you have to accept it, and implement it, however it's still nice to complain." You don't have to accept any

what kind of void test do u perform in paste industry

Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker

I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Fri Jun 16 20:40:43 EDT 2006 | mika

Hi Grant, I understand your concerns about the reliability. It depends what the boards are use for. For ex. if it is in a telecom system market where lifetime and reliability is a big issue 10-20 years lifetime (our customer reqs. that at the system

Help or nothing!?

Electronics Forum | Thu Jun 22 09:09:36 EDT 2006 | Chunks

Hi Evtimov, You need to call your manufacturer! Just joking! Sorry, but it is a "forum", which means you need to pick and choose your information carefully. Some are rookies that may give a simple or silly answer without knowing, some are seasone

cem audit check-list

Electronics Forum | Thu Jun 29 13:27:20 EDT 2006 | pjc

Verify that the CEMs machines and processes are capable of assembling the technology of your boards- smallest components, largest components, finest pitch, flex circuits, etc� Are their core competences aligned with your requirements- assembly only,

GSM2 Errors

Electronics Forum | Thu Jul 13 02:06:51 EDT 2006 | mika

bypass every pattern steps except 1 of them; the one step that calls for Head# 1 Now start with the first spindle on that head > for ex. no. 1 > save > load the new pattern in Dry cycle!!! > Run/Start. The reason for bypassing the fiducial check i


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