Electronics Forum | Thu Feb 25 04:24:15 EST 1999 | Charles Stringer
| | Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean
Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Tue Feb 16 16:25:18 EST 1999 | Tuffty
| We use both F4G and MCS at the present and we are phasing out MCS. One main reason is that it's platform is not Y2K compliant. F4G is cumbersome and taxes a high overhead on your computer system. We have also found a bug recently when we have hi
Electronics Forum | Tue Oct 27 16:11:36 EST 1998 | carl m
| | | | What are the key feature to look for in buying a profiling product for Reflow ? | | | | | | Who's is the best and how much do these systems cost ? | | | | | | Thanks in advance. | | | | | | Hi Mark, | | | | I am currently the oven secto
Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd
| Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... | | We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were
Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon
| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder
Electronics Forum | Fri Jul 24 18:24:46 EDT 1998 | Steve Gregory
> Enjoy knocking you as well (just joking) rather get onto Steve and Justin! >> Wayne HEY!! Wud I do? Jes 'cause I tried to scam a few Fosters and a shooter or two of Rumpleminz (nectar of the gods by the way, right next to Jaegermeister) don't make
Electronics Forum | Fri Jun 26 08:58:43 EDT 1998 | Justin Medernach
| WHAT IS THE BEST ANGLE FOR THE SQUEEGEE BLADE TO BE ANGLED AT? WE ARE USING 45 DEGREE ON OUR POLYURETHANE BLADES, AND I BELIVE WE HAVE THE OPTION OF EITHER 45 OR 60 DEGREES ON OUR METAL BLADES. WHICH OF THE TWO IS BETTER, OR SHOULD WE BE USING AN
Electronics Forum | Sat Jun 27 08:23:02 EDT 1998 | Dave F
| | WHAT IS THE BEST ANGLE FOR THE SQUEEGEE BLADE TO BE ANGLED AT? WE ARE USING 45 DEGREE ON OUR POLYURETHANE BLADES, AND I BELIVE WE HAVE THE OPTION OF EITHER 45 OR 60 DEGREES ON OUR METAL BLADES. WHICH OF THE TWO IS BETTER, OR SHOULD WE BE USING
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