Electronics Forum: ws 609 (Page 1 of 8)


Electronics Forum | Tue Apr 01 19:21:25 EST 2003 | Myu

I'm a user changing over from WS-609 to WS-709. WS-709 has less voiding problem and longer stencil life than WS-609. Ws-709 has a less foaming during washing process. Thanks, Myu

RTS (Ramp-to-Spike) and RSS (Ramp-soak-spike)

Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam

we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How

Cleaning procedure when WS609 flux is used

Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef

Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to


Electronics Forum | Mon Mar 31 14:15:05 EST 2003 | ksfacinelli

I am also interested in anyones obervations. I am most interested in anyone changing over from ws-609 to ws-709. I have read the technical information but I am most interested in hearing from a user.... Thanks, Kevin

caps have yellow stain after wash

Electronics Forum | Tue Jun 07 12:07:30 EDT 2016 | wlsmt

Sorry davef. I was not being clear. PCBAs came out cold soldered after being reflowed the first time with ALPHA WS-820. The flux gel ALPHA WS 609 was supposed to be applied only onto the terminations of caps where ALPHA WS-820 was for a second refl

Re: Aqueous Technologies Cleaners

Electronics Forum | Mon Dec 11 12:46:02 EST 2000 | Christopher Lampron

We too had a problem with the WS609. We have since switched to Alpha's WS619 (same formula with an anti-foaming agent) This really helped but we still monitor flux application and try to minimize wherever possible. Chris

Re: MicroBGA printing problem

Electronics Forum | Tue Sep 21 11:28:26 EDT 1999 | Dave F

| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi

Grainy soler

Electronics Forum | Fri Nov 22 08:59:49 EST 2002 | ksfacinelli

I would have to agree with the to high temp being a real problem. I have seen this with the WS-609 alpha paste. If you run it up to high in temp. The joints appear to be cold but they are really just over fried.....definitely try reducing temperat

Connector leads plating

Electronics Forum | Tue Dec 10 22:18:32 EST 2002 | davef

Randy's correct. If you were soldering to nickel with WS609, you would be complaining about non-wetting, not lumpy solder flow.

25 mil QFP soldering issue

Electronics Forum | Fri Jul 23 09:17:16 EDT 2004 | davef

The more we think about this, the more we think you should join the 20th century and upgrade from your good ol' WS609. We know this will be tough. We used the stuff for 10s of years.

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