Electronics Forum | Tue Apr 01 19:21:25 EST 2003 | Myu
I'm a user changing over from WS-609 to WS-709. WS-709 has less voiding problem and longer stencil life than WS-609. Ws-709 has a less foaming during washing process. Thanks, Myu
Electronics Forum | Mon Mar 31 14:15:05 EST 2003 | ksfacinelli
I am also interested in anyones obervations. I am most interested in anyone changing over from ws-609 to ws-709. I have read the technical information but I am most interested in hearing from a user.... Thanks, Kevin
Electronics Forum | Tue Jun 07 12:07:30 EDT 2016 | wlsmt
Sorry davef. I was not being clear. PCBAs came out cold soldered after being reflowed the first time with ALPHA WS-820. The flux gel ALPHA WS 609 was supposed to be applied only onto the terminations of caps where ALPHA WS-820 was for a second refl
Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam
we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How
Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef
Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to
Electronics Forum | Tue Jul 23 15:41:31 EDT 2002 | habs24
Does anyone have any information or experience soldering of class 3 products with WS fluxes. We are currently leaning toward Alpha WS609 flux, however the customer's interpretation of J-Std-001C feels that type 'H' fluxes (WS) are not allowed. Any
Electronics Forum | Mon Dec 11 12:46:02 EST 2000 | Christopher Lampron
We too had a problem with the WS609. We have since switched to Alpha's WS619 (same formula with an anti-foaming agent) This really helped but we still monitor flux application and try to minimize wherever possible. Chris
Electronics Forum | Tue Sep 21 11:28:26 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
Electronics Forum | Tue Jan 29 13:51:24 EST 2008 | bbarton
Dave F....BOGUS BOGUS BOGUS What compatability issue could there possibly be if the flux is removed during wash???? Why on EARTH would you leave ANY WS flux residue on the board? A recipie for disaster! Beef up the cleaning process, test for contami
.gif)
