Electronics Forum | Tue Jul 27 16:30:35 EDT 1999 | Earl Moon
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Thu Jun 03 09:40:20 EDT 1999 | Ryan Jennens
In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cannot
Electronics Forum | Wed Jan 06 10:51:33 EST 1999 | Scott McKee
| I would like comments from users about X-rays manufactured by Lixi Inc and Gleenbrook Technologies. Quality of product, servicing, ease of operation etc. | | We are currently looking into justification for such a product (table top) our next step
Electronics Forum | Tue Jun 16 15:10:27 EDT 1998 | Bob Willis
Simple x-ray inspection works well have a word with those nice people at Nicolet or Glenbrook. One of them was featured on my x-ray training video for BGA. A procedure for inspection criteria is on my web site if it is of use. | | How do I mechanical
Electronics Forum | Mon Apr 28 04:02:39 EDT 2003 | chrissieneale
Hey, i'm back from the holiday. Progress on this board is quite good actually, althought the guy who i got to take off and replace all the bga's won't even look me in the eye!! He said he had a really tough job re-doing all the paste. 22 BGA's in a
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Fri Nov 25 00:07:23 EST 2005 | pyramus
Nope actually the whole bluetooth component is a raw part comprising of BGA and chip components in one small PCB wherein this whole assembly is encased in a shield. So basically when we recieve the part we can only see the shield and some minor chi
Electronics Forum | Fri Feb 09 13:05:14 EST 2007 | realchunks
Lawyer questions in the fact that they are silly or seem so vague? "1. Can X-Ray Inspection System damage the EPROM OR OTP during inspection after Reflow?" No, not by typical X-ray equipment designed for PCB manufacturing. "2. At 300 degree Ce
