Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Mon May 22 12:04:03 EDT 2000 | Michael Parker
80%. There are too many factors at hand to point the finger yet. We need to build a truth table and dot the i's and cross the t's before stepping up to Goliath (Samsung). Is you placement guranteed good? What x-ray have you used? Are your fab.'s know
Electronics Forum | Mon May 22 16:50:50 EDT 2000 | Kathy Palumbo
Mike, Is that greater than 80% yeilds, or less than? Here are the answers to your questions: Is you placement guranteed good? YES What x-ray have you used? Nicolet Are your fab.'s known good? YES Could you de-solder Samsung and replace with ano
Electronics Forum | Mon Mar 12 10:13:43 EST 2001 | CAL
At APEX I was able to witness the BEAM WORKS Selective Laser Soldering machine operate.Truly impressive. When they told me they could solder a BGA component, I old them they were HIGH as a kite. The board they demonstrated had 4 BGA's on it. When the
Electronics Forum | Tue Mar 13 11:50:21 EST 2001 | gsmguru
Here is some general things I usually ask myself when having trouble with BGA's What type of BGA ? Pitch/Bump Dia etc. Smaller bumps sizes & tighter pitches require more attention. This also impacts stencil aperature design & paste selection. Was
Electronics Forum | Fri Mar 23 21:36:02 EST 2001 | CAL
If you do not have any luck finding a west coast lab, but need services I am sure we can help. The only problem is we are on the east coast. Many moons ago empf was on the west coast (China Lake) but moved eastward. We are in Philadelphia, PA. (ski
