Electronics Forum: x-ray and electronix (Page 1 of 6)

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 30 02:19:17 EDT 2010 | jooh

Regarding X-ray I was referring to ssager's comment "...X-Ray is only as good as the human eye that is operating it...". I thought x-ray images could be checked by software algorithms to find defects, not only human eye?

AXI and AOI

Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A

X-Ray inspection system w/ X- ray SMD component counter

Electronics Forum | Fri May 01 14:54:12 EDT 2020 | capse

Disclaimer, I'm a VJ Electronic Rep. The VJ Electronix XQuik II is an x-ray parts counter. You can load a PCBA into the system and capture an x-ray image. The system has zoom functionality. But, you will not get the type of measurement and inspection

Re: BGA rework station and x-ray inspector

Electronics Forum | Fri Jul 31 16:56:46 EDT 1998 | Steve Zweig

Check out www.glenbrooktech.com for x-ray systems

QFN's and LGA's

Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman

Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh

Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t

BGA assembly and inspection

Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung

Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass

AXI and AOI

Electronics Forum | Mon Jul 08 13:49:10 EDT 2002 | msjohnston

HI, We are looking into expanding our current x-ray inspection from manually inspection one panel per lot to 100% automated inspection for all of our BGA and CSP builds. We have 100% manual inspection at the end of our SMT lines and we are consideri

AXI and AOI

Electronics Forum | Tue Jul 09 10:15:17 EDT 2002 | msjohnston

Cal, Our parent company is a FAB and they are about to release a new generation of parts. Usually the die is qualified in a simple TSOP form factor. This time the first product quals will take place in the BGA and CSP from factors rather than the t

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

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