Electronics Forum | Mon Apr 27 19:31:12 EDT 2009 | stevek
Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that reduces the cross sectional area by 25% is about half the diameter of the ball. If it is closer to either termination, the corresponding size would
Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F
We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good
Electronics Forum | Mon Oct 12 04:55:54 EDT 2015 | akon63
Hiiiii The X36 Series encapsulates the most advanced development in x-ray imaging technology on the market with a full set of inspection tools, providing outstanding detection sensitivity for contamination detection and product integrity checks. V
Electronics Forum | Mon May 02 08:09:10 EDT 2005 | kodex
We are looking for full set of operation/maintenance manuals for CR Technologies, CRX-2000 x-ray inspection system. Thank you, Gary Korkala
Electronics Forum | Mon Jun 18 18:14:59 EDT 2001 | davef
Would comment extensively on the following? The time is a fact for X-ray inspection. If you set the contrast, tilting angle correctly (provide you did enough cross section to know the few type of failure mode: e.g. smaller balls, shorts, missing on
Electronics Forum | Sun Dec 28 05:31:59 EST 1997 | Bob Willis
We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk | | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection |
Electronics Forum | Mon Apr 07 07:08:04 EDT 2003 | cyber_wolf
Does anyone have an example of an electronics X-ray quality procedure? We are implementing a new X-ray machine and it is my responsibility to compose the quality procedure. I know that each state has it own set of regulations, I am just curious to se
Electronics Forum | Tue Apr 03 00:55:34 EDT 2001 | philipreyes
Hello Billy!! IPC 7095 covers all the design rules and guide lines in BGA assembly and inspection, this will help you a lot in your problem...But based on your problem, it seems that all the balls were disappeared, try to check the capability of
Electronics Forum | Thu Jan 15 15:28:22 EST 2009 | wavemasterlarry
My brother is OK now. Had to set his hair fixed but looks fine.
Electronics Forum | Thu Jul 15 07:16:55 EDT 1999 | Steve
Hello All, I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? Also anyone who is mounting CSP/uBG
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