Used SMT Equipment | Pick and Place/Feeders
yv100xg pick and place machine used smt equipment condition:running Yamaha YV100xg parameters 1. High-speed high-precision multi-function modular placement machine 2.0.18 seconds / CHIP super high speed placement (optimal conditio
Used SMT Equipment | Pick and Place/Feeders
Board size L460*W335(MAX)-L50*W50(MIN) Mounting Accuracy Absolute Accuracy (μ+3σ ±0.05mm/chip, ±0.05mm/QFP Mounting speed 16200CPH Mountable Components 0603-31mm SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA Air 5 K
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100XG/XGP Brand: YAMAHA Substrate size: :L500 * W440 (MM) — L50 * W50 (MM) Accuracy: 0.018mm Patch speed: 0.18 seconds/CHIP Mounting range: 0201 to 31mmQFP Rated voltage: three-phase 220V Rated power: 4.4kVA/0.65KW Air pressure
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
Used SMT Equipment | Pick and Place/Feeders
YAMAHA YV100XG YV100X PICK AND PLACE MACHINE YAMAHA YV100XG YV100X PICK AND PLACE MACHINE email:smtdwx@163.com TEL: 86-0755-33160359 m/p:+86-15915451009 WhatsApp:+8615915451009 QQ:382304263 skype :smtdwx http://www.dwxyamaha.com Our compan
Used SMT Equipment | Pick and Place/Feeders
YAMAHA placement machine-YV180Xg equipment parameters: Theoretical mounting speed: 0.095 seconds/CHIP, actual 20000CHIP/H. Production PCB size: L330 x W330 ∼ L50 x W50mm / t = 0.4 ∼ 3.0mm. SMD components range: 0402∼SOP, SOJ, 84 Pin
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100X parameters Substrate size ATS20 (end orientation) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed 100 kinds (8MM) Board transfer direction right-left Mounting accuracy ±0.1m
Used SMT Equipment | Pick and Place/Feeders
yv100xe used machine Substrate size ATS20 (final placement) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed in 100 kinds (8MM) Substrate transfer direction right-left Mounting accuracy ±0.1mm/C
Used SMT Equipment | Chipshooters / Chip Mounters
I-PULSE M20 Chip Mounter model LE6-000 l New type of large field of view high-precision 2 million pixel ultra-high-speed (3000mm/sec) digital scanning camera l 0402(01005)－□120mm×90mm component corresponding range l High-perf
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100 Products in detail YAMAHA multi-function chip mounter YAMAHAYV100A Substrate size: ATS20 (end to put) W - ATassembly: L460 * W250 (Max)/L50 * W50 (Min) Substrate thickness: 0.4 to 3.0 Substrate transfer direction: right and
