Electronics Forum: yield (Page 21 of 55)

Re: 0402 pick problems

Electronics Forum | Fri Nov 17 00:27:30 EST 2000 | DL

Kris, I gather from your description that the component can not be picked consistently. Meaning that the machine can place the component. How does the component place? Is the placement text book? Take a good look to see if the component isn't being

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 12:13:16 EDT 2000 | Steve Thomas

I'd like to respond here not just to throw in my $.01 (I yield at least a penny to the more knowledgeable contributors), but to verify that my thoughts on this are reasonable... How about, you either do in-process inspection or testing, or you valid

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Tue Oct 03 15:27:37 EDT 2000 | Wolfgang Busko

What�s wrong with your printing process and what improvement do you expect from dispensing ? I can imagine that it�s more convinient just to have this process inline, no worrying about stencils, cleaning, changing printer setting, just replacing a ca

Re: Equipment/Line Capability Study

Electronics Forum | Tue Sep 26 11:03:00 EDT 2000 | Wolfgang Busko

Greg: You might look for : - smallest board size - largest board size - finest pitch you are able to handle (safe) - Parts/hour - units/hour (If you find your bottleneck it will be easy to determine) - number and kind of feeders, components per line

Re: Wave solder of TQFPs

Electronics Forum | Thu Jul 20 10:03:30 EDT 2000 | Bob Willis

All the points raised so far are correct. Only use QFPs if rearly pushed as the yield on your process will suffer. I have wave soldered parts down to 0.020" in nitrogen with OK results but the pads and drainage pads need to be worked on. Another r

Re: Stencil Cleaner

Electronics Forum | Fri May 12 13:12:47 EDT 2000 | Bill Schreiber

There are several published papers on the Smart Sonic Web Site regarding the advantages and disadvantages of using a stencil cleaner. I recommend the papers by Richard Clouthier "Improving Screen Print Yields" and "Selecting SMT Stencil Cleaning Me

Re: 0201Technology

Electronics Forum | Wed May 10 15:36:36 EDT 2000 | C.K.

I agree with you PR!! At our factory, we had trouble with 0603's!!!! Especially if you try to glue and wave them...manufacturing management, in turn, blamed the declining yields on the processes, and NOT on the product! ...and with process windows

AOI systems

Electronics Forum | Fri Mar 30 07:14:42 EST 2001 | pteerink

Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no

AOI systems

Electronics Forum | Fri Mar 30 07:14:51 EST 2001 | pteerink

Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no

BGA CORNER WARP

Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark

BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think


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