Electronics Forum: yield (Page 26 of 55)

SnPbAg solder paste at reflow oven

Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax

I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo

Visual alignment problems on BGA's for QSV-1

Electronics Forum | Wed Apr 11 14:57:31 EDT 2007 | itwasbill

Hi all! We are placing BGA's using a QSV-1 pck and place machine. I believe our profile has the correct information but we continue to get vision results not available when we inspect the part. Our screen appears as follows: NO RESULTS AVAILABLE PAR

Mix Technology Board Processes

Electronics Forum | Thu Apr 26 16:55:31 EDT 2007 | ratsalad

I am guessing Theresa is saying when that some SMT parts are soldered (not glued) very close to some PTH parts. So close that they can't effectively mask the SMT parts and have an opening for the PTH part. At the company where I work, we've been tr

MyData Missing Placements

Electronics Forum | Wed Jul 11 14:27:56 EDT 2007 | fredericksr

1) Swapped it out a few weeks ago to attempt to combat the problem ... Great minds eh? 2) I'll try changing the position setting to see if my yields improve. 3) Ahh yes, in fact, I have verified that our vacuum levels are low (range ~130). The

VOC Free Flux

Electronics Forum | Wed Oct 10 08:01:28 EDT 2007 | ck_the_flip

We use Indium 1074-EXR on ERSA, and it's performed miracles on our yields. Spot soldering, like wave, is all about fundamentals. Put just enough flux, preheat to prevent thermal shock and activate the flux, and then solder with enough dwell time to

via under a smd pad ?

Electronics Forum | Wed Nov 21 15:02:46 EST 2007 | jlawson

From info I have been told from design standpoint, via in pads helps with managing EMC issues with working design, in particular for high speed digital/dense populated type PCB's. We had a manufacturing customer that had very low yield because of th

Board support

Electronics Forum | Mon Nov 12 07:59:38 EST 2007 | ck_the_flip

N ot another thread on PCB support! O f all the topics, this one has been much repeated. T o each his own, i guess for brining up this H eck, this topic is almost as repeated as stencil cleaning. E ngineers SHOULD be hands on, I agree. No

Looks like we'll be BGAing in the near future

Electronics Forum | Wed Feb 06 16:05:24 EST 2008 | dphilbrick

At one point in time we were putting TI NanoStar parts on these particular boards. You don't want to attempt this at home! Thank God they took them off. Part was 1.45 X 1mm with 6 .1mm balls. They were a pain in the A$$. We had about a 90% success ra

stencil apertures for BGA

Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej

Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio

Process Costing

Electronics Forum | Thu Feb 05 23:55:52 EST 2009 | sachu_70

Considering a lean management on your shopfloor, any amount of inspection being done to a board, either by QA or Production personnel, does not add value to your product but instead, adds to your operational cost. You can explore to possibility of ca

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